Government contractor and tender participant
| Buyer Organization | Contracts | Total Value |
|---|---|---|
| Fraunhofer-Gesellschaft - Einkauf B12 | 1 | - |
| Tender | Buyer | Contract Value |
|---|---|---|
| High Precision bonder for wafer and chiplet level assembly (... | Fraunhofer-Gesellschaft - Einkauf B12 | - |