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Tenders

SUB MICRON ACCURAY FLIP CHIP DIE BONDE FOR RESEARCH AND SMALL VOLUME PRODUCTION

Closed
Deadline
Deadline not specified
Contract Details
Category
Supplies
Reference
2022-107597
Value
€272,500
Location
Finland
Published
August 20, 2026
CPV Code
Budget
€272,500
Duration
Not specified
Location
Finland
Type
Supplies

Original Tender Description

The object of the tender process was a manual of semiautomatic flip chip die bonder with high placement accuracy and flexibility to different bonding technologies (later also “Equipment”). Main use is research and low volume bonding. Bonder must be able to handle wide scale of different chip sizes and capability to accurately control bond force. Accuracy should targeted below 1 um and advanced alignment features are key parameters. Besides of normal pad alignment also alignment to features aroun

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Basic Requirements

  • Company registration in EU required
  • Proven track record in similar projects
  • Financial stability documentation

Documents

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