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Delivery and installation of an ICP Reactive ion etcher for silicon dielectrics

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In brief

Danmarks Tekniske Universitet - DTU is acquiring a high ion density source reactive ion etcher for oxides and nitrides of silicon for its Nanolab cleanroom in Denmark. The instrument will be the new primary tool for 150 mm wafer processing. The deadline for submission is 23 November 2026. Details and submission instructions are on the eu.eu-supply.com portal.

Updated October 12, 2026

Deadline
42 days left
November 23, 2026
Contract Details
Category
Other
Reference
00701524-2026
Value
Not disclosed
Location
Hovedstaden, Denmark
Published
October 05, 2026
CPV Code
Project Timeline

Tender Published

October 12, 2026

Deadline for Questions

November 16, 2026

Submission Deadline

November 23, 2026

View Original

Key facts

Buyer
Danmarks Tekniske Universitet - DTU
Deadline
42 days left
CPV Code
42000000 — Industrial machinery
Procedure
Competition
Source
[tender_detail.portals.danish]
Budget
Not disclosed
Duration
Not specified
Location
Hovedstaden
Type
Other

Original Tender Description

DTU Nanolab wishes to acquire a high ion density source reactive ion etcher for oxides and nitrides of silicon to become its new primary instrument for 150 mm wafer processing. Delivery is expected no later than Q3 2027. The Instrument will be installed in the DTU Nanolab cleanroom - a university facility providing a comprehensive suite of micro- and nanofabrication tools. It serves a diverse community of over 200 active users, ranging from novice students to experienced researchers, as well a h

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Basic Requirements

  • Company registration in EU required
  • Proven track record in similar projects
  • Financial stability documentation

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