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Supply of a Plasma Etch Tool for Silicon Carbide (SiC) Etching

Closed

Submission Deadline Has Passed

This tender's submission deadline has passed and is no longer accepting applications. The information below is kept for reference purposes.

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Deadline
Expired
May 17, 2021
Contract Details
Category
Open Procedure
Reference
014061-2021
Value
Not disclosed
Location
Wales, United Kingdom
Published
April 13, 2026
Organization
Swansea University
CPV Code
Project Timeline

Tender Published

June 21, 2021

Deadline for Questions

May 10, 2021

Submission Deadline

May 17, 2021

View Original
Budget
Not disclosed
Duration
Not specified
Location
Wales
Type
Open Procedure

Original Tender Description

This Tender Specification is for the supply and delivery of a Plasma Etch Tool for SiC etching. In procuring this system, the University is seeking to augment its well-established existing plasma etch and deposition tool set, expanding the capabilities that the CISM will be able to provide. The new tool will be of strategic importance in delivering both frontside SiC etch capability for power MOSFET trench applications, and backside SiC via etch capability for GaN-on-SiC device applications. Reliability of the equipment is therefore paramount to maintaining, supporting and complimenting the wide array of experimental work that will be conducted within the facility.

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Basic Requirements

  • Company registration in EU required
  • Proven track record in similar projects
  • Financial stability documentation

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