Supply of a Plasma Etch Tool for Silicon Carbide (SiC) Etching

This Tender Specification is for the supply and delivery of a Plasma Etch Tool for SiC etching. In procuring this system, the University is seeking to augment its well-established existing plasma etch and deposition tool set, expanding the capabilities that the CISM will be able to provide. The new tool will be of strategic importance in delivering both frontside SiC etch capability for power MOSFET trench applications, and backside SiC via etch capability for GaN-on-SiC device applications. Reliability of the equipment is therefore paramount to maintaining, supporting and complimenting the wide array of experimental work that will be conducted within the facility.