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Tenders

Supply, Delivery and Installation of Solder Jetting Equipment

Open
Deadline
22 days left
August 31, 2026
Contract Details
Category
Open Procedure
Reference
072058-2026
Value
Not disclosed
Location
West Central Scotland, United Kingdom
Published
August 02, 2026
CPV Code
Project Timeline

Tender Published

July 30, 2026

Deadline for Questions

August 24, 2026

Submission Deadline

August 31, 2026

View Original
Budget
Not disclosed
Duration
Not specified
Location
West Central Scotland
Type
Open Procedure

Original Tender Description

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology – reducing time-to-market and anchoring value onshore. Description A Solder Jetting capability is required to process photonic and semiconductor devices to allow them to be integrated into advanced packages.

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Basic Requirements

  • Company registration in EU required
  • Proven track record in similar projects
  • Financial stability documentation

Documents

3 documents available with AI summaries

OCDS RecordDOC
072058-2026_ocds_record.json

No summary available for this document.

OCDS Release PackageDOC
072058-2026_ocds_release.json

No summary available for this document.

Official PDF VersionPDF
072058-2026_official.pdf

No summary available for this document.

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