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Tenders

AUTOMATIC WAFER GRINDER

Closed
Deadline
Deadline not specified
Contract Details
Category
Supplies
Reference
2023-136021
Value
€739,030
Location
Mainland Finland, Finland
Published
August 02, 2026
CPV Code
Project Timeline

Tender Published

September 08, 2023

Budget
€739,030
Duration
Not specified
Location
Mainland Finland
Type
Supplies

Original Tender Description

The object of the tender was an Automatic Wafer Grinder, capable of thinning Si and SiC, LiNbO3 wafers of 100, 150 and 200mm diameter to varying thicknesses with end-point control, cassette-to-cassette processing, TTV profile control and capability to handle thin wafers 100um thick supported by tape and grind away bonded wafer stacks to within 3 um of a typical interface. The object of the tender process was described in more detail in the invitation to tender documents. The object of the ten

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Basic Requirements

  • Company registration in EU required
  • Proven track record in similar projects
  • Financial stability documentation

Documents

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